InSight 300 is a fab-ready automated atomic force microscope (AAFM) designed for reliable, cost-effective inline metrology in high-volume semiconductor manufacturing environments. With <±1nm scanner flatness and a best-in-class noise floor of <35pm, this system meets the rigorous requirements of advanced CMP and etch applications, from micron-roughness to fully automated bare-wafer defect review. Its profilometry capabilities meet and exceed the millimeter-scale and bevel-edge metrology requirements for cutting-edge hybrid bonding applications. InSight 300 also features Bruker-proprietary operating modes for optimized measurements of sidewall roughness, automatic bare-wafer defect review, and advanced profiling of feature surfaces.
