SmartProber-TT

The Bruker Wafer Clean 2200 System removes particulate contamination and thin film organic residues from silicon, compound semiconductor, MEMS and thin film head substrates using a unique carbon dioxide (CO₂) snow cleaning process. CO₂ snow cleaning is fast, environmentally friendly and non-damaging. The all-dry process offers numerous advantages over conventional wet and plasma cleaning techniques. This fully automated, high volume production system is field proven with over 100 systems running 24/7 in high volume production applications around the globe.

The SmartProber-P1 is aimed at the next-generation over 5.5 kOe. Various configurations of this type of SmartProber are available. If the high perpendicular field is required, but only small samples need to be measured, the automated wafer stage can be replaced with a cheaper manual stage.

SP-P1 – 6kOe magnet, 300mm rotary wafer-stage
Configuration options:
C: Additional in-plane magnet module with a field strength of 2kOe
Y: 200mm XY wafer-stage
M: Manual wafer-stage for small samples
L: 10kOe magnet