The Bruker Wafer Clean 2200 System removes particulate contamination and thin film organic residues from silicon, compound semiconductor, MEMS and thin film head substrates using a unique carbon dioxide (CO2) snow cleaning process. CO2 snow cleaning is fast, environmentally friendly and non-damaging. The all-dry process offers numerous advantages over conventional wet and plasma cleaning techniques. This fully automated, high volume production system is field proven with over 100 systems running 24/7 in high volume production applications around the globe.
